Czochralski silicon wafers
Versatile substrates with controlled dopant and resistivity options.
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Silicon materials, precisely specified.
Browse core, special-dimension and engineered wafer categories—each available as a starting point for a focused technical quotation.
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Portfolio
Core wafer types
Foundational substrates for semiconductor fabrication and research.
Portfolio
Grade & form factor
Material formats aligned with development, testing and production needs.
Prime silicon wafers
High-quality polished wafers for device production and critical processing.
Test silicon wafers
Cost-effective process-monitoring and equipment-qualification substrates.
Reclaimed silicon wafers
Restored substrates for non-device runs and process development.
Diced silicon wafers
Precision-cut pieces and dies prepared to specified dimensions.
Portfolio
Special & engineered
Custom dimensions, surfaces and layers for specialized processes.
Ultra-thin wafers
Precision-thinned substrates for compact and high-performance devices.
Ultra-thick wafers
Robust substrates for specialty handling and mechanical applications.
Thermal oxide wafers
Controlled SiO2 layers for insulation, masking and research.
Nitride wafers
LPCVD or PECVD SiN films tailored to process needs.
Metal-film wafers
Engineered metal coatings for device and research applications.
Technical enquiry
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