Custom wafer engineering

Built around your process, not the shelf.

Configure the dimensional, electrical and surface characteristics your application requires, with a guided technical review before quotation.

Build your wafer

Specification framework

Every critical parameter, made clear.

Start with what you know. Our technical team can help clarify open parameters and feasibility.

01

Wafer foundation

Choose wafer type, grade, diameter and thickness.

02

Crystal & electrical

Define orientation, conductivity, dopant and resistivity.

03

Surface finish

Specify SSP, DSP, TTV, bow, warp and edge requirements.

04

Engineered layers

Add oxide, nitride or metal films with controlled thickness.

05

Handling & supply

Set cleaning, packaging, quantity and delivery expectations.

DIAMETERCustom
THICKNESSControlled
ORIENTATION<100> / <111>
SURFACESSP / DSP
LAYERSEngineered

Technical guidance

Not every parameter is known at the start.

Tell us the intended application, process conditions and desired outcome. We can use that context to structure a more complete specification for review.

Talk to a specialist

Technical enquiry

Configure your custom wafer.

Share your requirements and get a focused technical review from our team.

Request technical pricing